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1. Product Introduction
Manufactured by Guangdong Hongzhan under the brand Lab Companion, thermal cycling test chambers are specially developed for reliability testing of optical communication chips and optoelectronic components with various package forms, including optical transmit modules, optical receiver assemblies, memory chips, MCUs and other semiconductor devices.
Lab Companion offers a full range of chamber internal volume options, delivering a stable temperature environment with excellent uniformity for high-low temperature alternating tests. It provides a complete turnkey reliability verification solution for optical modules under extreme temperature conditions.
2. Standard Optical Module Testing Procedure
2.1. Sample Mounting
Fix the DUT optical modules onto dedicated test fixtures and carriers for stable placement and accurate temperature sensing.
2.2. Temperature Profile Setup
Program test temperature ranges via the Lab Companion thermal cycling chamber. Standard setpoints such as 0°C, 40°C and 70°C are commonly used; fully customizable high/low temperature limits are available per customer specifications.
2.3. Live Powered Testing
Power up the optical modules to simulate real-world operating loads and working conditions.
2. 4. Synchronous Parameter Measurement
Link the chamber with optical test instruments to synchronously measure key metrics such as receiving sensitivity and optical output power, so as to evaluate device performance under rapid temperature variations and extreme thermal stress.
2. 5. Data Analysis & Validation
Compile and analyze full-cycle test data to verify whether the optical modules consistently meet design specifications across different temperature levels and repeated thermal cycles.
3. Comparative Advantages: Lab Companion TS Series vs. Conventional Thermal Cycling Chambers
|
Item |
Lab Companion TS Series Thermal Cycling Chamber |
Traditional Standard Thermal Cycling Chamber |
|
Temperature Range |
-60℃ ~ +150℃ ultra-wide temperature span to support wide-temperature qualification of advanced chips |
Mostly limited to -40℃ ~ +120℃, insufficient for wide-temperature component validation |
|
Temperature Ramp Rate |
Linear adjustable 5~25℃/min, fully programmable heating/cooling slopes for high test throughput |
Max ramp rate ≤3℃/min, slow temperature transition leading to long testing cycles |
|
Temperature Accuracy & Uniformity |
Temperature accuracy ±1.0℃, superior chamber uniformity, CNAS traceable calibration available |
Large temperature deviation inside the chamber, poor uniformity and obvious thermal drift during long-term cycling |
|
DUT Direct Temperature Monitoring |
Accepts external T/K-type thermocouples to measure actual surface temperature of chips/modules directly |
Only measures ambient air temperature inside the chamber, unable to capture real device core temperature |
|
Thermal Shock Function |
3-chamber independent heat storage structure; shock transition time ≤12 seconds. One unit performs both thermal cycling and thermal shock tests |
Only slow thermal cycling function; incapable of rapid thermal shock stress screening |
|
Control System |
Multi-segment programmable profiles with adjustable cycle counts, dwell time and ramp rates; power-off resume function for complex test sequences |
Basic limited programming with few segments, unable to execute sophisticated cyclic stress profiles |
|
Communication Interfaces |
Standard equipped with Ethernet, IEEE 488 and RS232 ports for seamless integration with automated test platforms and load boards |
Limited single communication port, difficult to interface with automatic semiconductor test systems |
|
Refrigeration System |
Cascade air-cooled refrigeration system for stable 24/7 continuous operation; no liquid nitrogen (LN₂) or CO₂ auxiliary cooling required |
Single-stage refrigeration with weak low-temperature load capacity, prone to temperature drifting under prolonged continuous cycling |
|
Anti-Static Protection |
Industrial-grade full ESD protection structure, safe for sensitive semiconductors and optoelectronic devices |
No dedicated anti-static design; high risk of electrostatic damage to delicate samples |
4. Key Specifications, Certifications & Application Scope
Lab Companion thermal shock chambers cover the same wide temperature range of -60℃ ~ +150℃, featuring integrated industrial ESD construction and cascade air-cooled refrigeration without LN₂ or CO₂ consumption.
• Temperature display accuracy: ±0.5℃
• Calibration: CNAS traceable
• Certifications: ISO 9001, CE, RoHS compliant
With robust closed-loop temperature control algorithms and flexible multi-segment programming, the chambers minimize environmental interference and ensure repeatable test results for both laboratory R&D verification and mass production line quality inspection.
Typical Applications:
Reliability thermal stress testing for RF/microwave components, optical communication modules, power semiconductors and communication ICs, supporting product characterization, performance validation and failure analysis.
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