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温度湿度試験室

温度湿度試験室

  • JESD22-A101B Compliant Environmental Testing Solution | Lab Companion Temperature & Humidity Test Chamber for Semiconductor Moisture Resistance Validation
    Aug 18, 2026
    1. Industry Overview: JESD22-A101B Steady-State Humidity Testing for Semiconductor Reliability JESD22-A101B is a globally recognized JEDEC standard for steady-state temperature and humidity reliability testing. It defines standardized test conditions, operational procedures, and failure criteria for semiconductor packaged devices under high-temperature and high-humidity environments. This specification is widely adopted for reliability qualification of IC chips, power devices, and various packaged semiconductors across the global semiconductor industry. Semiconductor plastic packages, lead frames, encapsulation adhesives, and passivation layers are highly susceptible to moisture penetration. Under prolonged high-temperature and high-humidity stress, moisture ingress causes package hydrolysis, metal lead corrosion, interface delamination, and internal circuit oxidation. These failures lead to increased leakage current, performance degradation, and complete device malfunction in field applications. JESD22-A101B testing simulates real-world humid storage and operating conditions in a controlled laboratory environment. It effectively identifies semiconductors with insufficient moisture resistance before mass production, significantly reducing field failure risks. Today, JESD22-A101B has become a mandatory reliability item for mainstream semiconductor packaging, testing, and component manufacturing factories worldwide. Lab Companion offers fully JESD22-A101B compliant temperature and humidity test chambers. We provide a complete overseas testing solution including standard-matched hardware, remote test program calibration, and customized sample fixturing to support semiconductor labs in conducting accurate, repeatable moisture reliability validation. 2. Key Challenges in JESD22-A101B Semiconductor Humidity Testing Semiconductor packages are compact and precision-structured. JESD22-A101B requires extremely strict control over chamber uniformity, long-term operational stability, and humidity consistency. Ordinary environmental test equipment frequently fails to meet standard requirements, causing invalid tests and inconsistent data. 2.1 Poor Chamber Uniformity Causes Unrepeatable Batch Test Results JESD22-A101B specifies strict temperature and humidity distribution tolerances within the test chamber. Conventional chambers suffer from defective airflow and humidification system designs, creating obvious temperature and humidity gradients. Devices placed in different positions receive inconsistent environmental stress. Weak uniformity leads to undetected latent defects, discrete test data, and non-compliant qualification results. 2.2 Long-Duration Testing Humidity Drift Leads to Test Failure JESD22-A101B tests typically require hundreds of hours of continuous unattended operation. Most general-purpose chambers cannot maintain stable humidity output during long-cycle high-humidity aging. Humidity drift and fluctuation deviate from standard set points, resulting in invalid tests, wasted samples, and increased laboratory time costs. 2.3 Lack of Semiconductor-Specific Fixtures Affects Test Validity Semiconductors include diverse package types such as BGA, QFP, SOP, and power modules. Standard generic shelves provide no positioning protection. Stacked placement causes lead deformation and physical damage. Improper loading also blocks internal airflow, further deteriorating chamber uniformity and compromising test accuracy. 2.4 High Humidity Operation Accelerates Equipment Aging & Technical Support Gaps Long-term high-temperature and high-humidity operation continuously erodes chamber interiors, humidifying components, and sensors. For overseas users, local on-site maintenance is unavailable with ordinary equipment brands. Sensor drift, water circuit faults, and system deviations cannot be resolved promptly, causing test suspension and project delays. 3. Lab Companion Hardware Advantages for Full JESD22-A101B Compliance Lab Companion temperature and humidity chambers are fully optimized and calibrated to meet JESD22-A101B standard requirements. All core control systems, airflow structures, and operational logic are tailored for semiconductor long-term humidity aging tests. 3.1 High Precision & Excellent Uniformity for Batch Testing The chamber supports a temperature range of -70℃ ~ +150℃ and a humidity range of 20%RH ~ 98%RH, with temperature accuracy of ±0.5℃ and humidity accuracy of ±2.5%RH. The optimized circulating airflow system ensures uniform temperature and humidity distribution across the entire workspace. Even in full-load batch testing, all DUTs (devices under test) receive identical environmental stress, ensuring consistent and repeatable test data. The equipment supports continuous long-term aging with minimal parameter drift, fully complying with JESD22-A101B long-cycle test specifications. 3.2 Programmable Controller for Standard Test Recipe Storage Equipped with an intelligent touchscreen programmable controller, the chamber supports full parameter configuration and storage of standard JESD22-A101B temperature, humidity, and dwell-time recipes. Users can save customized test procedures for different semiconductor packages and recall one-click startup for subsequent tests. This eliminates repetitive manual setting errors and greatly improves laboratory testing efficiency. 3.3 Custom Semiconductor Fixtures for Safe & Accurate Loading Lab Companion provides customized non-blocking fixture trays for BGA, QFP, SOP, and power module devices. The dedicated positioning structure prevents lead collision and mechanical damage during testing. The hollowed-out design ensures unobstructed internal airflow, enabling full environmental coverage for every device and eliminating placement-induced test deviations. 4. JESD22-A101B Validation for Full-Range Semiconductor Devices Lab Companion solutions support standardized moisture resistance qualification for mainstream semiconductor components: • IC Chips (BGA/QFP): Evaluate encapsulation moisture permeability and screen package delamination risks. • Power Modules: Verify sealing tightness and lead corrosion resistance under continuous high-humidity conditions. • Small Discrete Devices: Screen hidden defects in adhesive layers and passivation layers via batch steady-state humidity aging. All tests strictly follow JESD22-A101B standard conditions and duration requirements. Post-test validation includes electrical performance testing, visual inspection, and acoustic scanning analysis to identify moisture-induced failures. This mature qualification solution has been widely adopted by professional semiconductor testing laboratories. 5. Global Remote Technical Support & Complete Solution Service To serve global clients efficiently, Lab Companion provides full-process online remote technical support for overseas users (no local on-site service), ensuring stable and compliant test operation worldwide. 5.1 Professional Remote Guidance & Troubleshooting Our professional engineering team provides one-stop remote support including JESD22-A101B recipe debugging, parameter calibration, fixture scheme confirmation, daily equipment operation guidance, and remote fault diagnosis. Fast online response effectively avoids test suspension and project delay caused by equipment parameter deviation or operational errors. 5.2 Standard Compliance Technical Consulting We provide professional standard interpretation and process guidance for new-built reliability laboratories. Our team assists users in establishing standardized pre-test and post-test performance comparison processes to ensure all test procedures fully meet JEDEC certification and audit requirements. 5.3 Full-Spectrum Environmental Test Equipment Portfolio Beyond JESD22-A101B humidity testing, Lab Companion offers a full lineup of self-developed environmental test equipment, including thermal shock chambers, rapid temperature change chambers, and walk-in environmental rooms. We support comprehensive semiconductor reliability tests such as temperature cycling, thermal shock, and ESS screening, providing global clients with one-stop environmental qualification solutions. 6. Conclusion Moisture-induced package delamination, metal corrosion, and performance degradation are critical failure modes for semiconductor devices. As the core JEDEC standard for moisture resistance qualification, JESD22-A101B demands high-precision, high-stability, and high-uniformity test equipment. Lab Companion temperature and humidity chambers deliver wide-range precise control, excellent chamber uniformity, long-term operational stability, programmable standard recipes, and customized semiconductor fixturing. Combined withglobal professional remote technical support, our standardized JESD22-A101B testing solution helps overseas semiconductor manufacturers and testing labs achieve accurate, repeatable, and compliant moisture reliability validation, ensuring consistent product quality and field operational reliability.
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  • IEC 68-2-66 試験方法 Cx: 定常湿熱(非加圧飽和蒸気)
    Apr 18, 2025
    序文 この試験方法の目的は、高温・低温および多湿の環境試験室で小型電気技術製品(主に非密閉部品)の耐性を評価するための標準化された手順を提供することです。 範囲 この試験方法は、小型電気技術製品の加速耐湿熱試験に適用されます。 制限事項 この方法は、腐食や変形など、試験片の外部影響を検証するのには適していません。 テスト手順1. 事前テスト検査 試験片は、関連規格に規定されている目視、寸法、機能の検査を受けなければなりません。 2. 標本の配置 試験片は、温度、相対湿度、大気圧が実験室の条件下にある試験室に設置されます。 3.バイアス電圧の印加(該当する場合) 関連する規格によってバイアス電圧が必要な場合は、試料が熱と湿度の平衡に達した後にのみバイアス電圧を印加する必要があります。 4. 温度と湿度の上昇 温度は規定値まで上昇させるものとする。この間、チャンバー内の空気は蒸気によって置換されるものとする。 温度と相対湿度は指定された制限を超えてはなりません。 試験片上に結露が発生しないこと。 温度及び湿度の安定化は1.5時間以内に達成されなければならない。試験時間が48時間を超え、1.5時間以内に安定化が完了しない場合は、3.0時間以内に安定化されなければならない。 5. テスト実行 関連する規格に従って、温度、湿度、圧力を指定されたレベルに維持します。 テスト期間は、定常状態に達した時点で開始されます。 6. テスト後の回復 指定された試験期間が経過した後、チャンバーの状態は標準大気状態(1~4 時間)に戻される必要があります。 回復中は温度と湿度が指定された制限を超えてはなりません (自然冷却は許可されます)。 標本は、さらに取り扱う前に完全に安定させる必要があります。 7. テスト中の測定(必要な場合) 試験中の電気的または機械的な検査は、試験条件を変更せずに実行する必要があります。 回収前にチャンバーから標本を取り出してはなりません。 8. 試験後検査回復後(標準条件下で 2 ~ 24 時間)、試験片は関連規格に従って目視、寸法、機能検査を受ける必要があります。 --- テスト条件特に指定がない限り、試験条件は表 1 に記載されている温度と期間の組み合わせで構成されます。 --- テストセットアップ1. チャンバーの要件 温度センサーはチャンバー温度を監視するものとする。 試験前にチャンバー内の空気を水蒸気でパージする必要があります。 凝縮液が標本の上に滴り落ちてはいけません。 2. チャンバー材料チャンバー壁は蒸気の品質を低下させたり、試料の腐食を引き起こしたりしてはなりません。 3. 温度均一性総許容誤差(空間変動、変動、測定誤差):±2°C。 相対湿度許容範囲 (±5%) を維持するために、温度上昇/下降中であっても、チャンバー内の任意の 2 点間の温度差を最小限に抑える必要があります (≤1.5°C)。 4. 標本の配置試料は蒸気の流れを妨げてはなりません。 直接の輻射熱への曝露は禁止されています。 固定具を使用する場合は、試験条件に影響を与えないように、固定具の熱伝導率と熱容量を最小限に抑える必要があります。 器具の材料は汚染や腐食を引き起こしてはなりません。 3. 水質 蒸留水または脱イオン水は、次の場合に使用してください。 23°Cでの抵抗率≥0.5MΩ·cm。 23℃でpH6.0~7.2。 チャンバー加湿器は、水を導入する前にこすり洗いして清掃する必要があります。 --- 追加情報表2は乾燥温度(100~123℃)に対応する飽和蒸気温度を示しています。 単一容器および二重容器試験装置の概略図を図 1 および 2 に示します。 --- 表1: テストの厳しさ| 温度 (°C) | 相対湿度 (%) | 期間 (時間、-0/+2) | 温度相対湿度時間(時間、-0/+2)±2℃±5%ⅠⅡⅢ110859619240812085489619213085244896注: 110°C、120°C、130°C における蒸気圧はそれぞれ 0.12 MPa、0.17 MPa、0.22 MPa となります。 --- 表2: 飽和蒸気温度と相対湿度の関係 (乾燥温度範囲:100~123℃)飽和温度(℃)相対的湿度(%RH)100%95%90%85%80%75%70%65%60%55%50%乾燥温度(℃) 100 100.098.697.195.593.992.190.388.486.384.181.7101 101.099.698.196.594.893.191.289.387.285.082.6102 102.0100.699.097.595.894.092.290.288.185.983.5103 103.0101.5100.098.496.895.093.192.189.086.884.3104 104.0102.5101.099.497.795.994.192.190.087.785.2105 105.0103.5102.0100.498.796.995.093.090.988.686.1106 106.0104.5103.0101.399.697.896.093.991.889.587.0107 107.0105.5103.9102.3100.698.896.994.992.790.487.9108 108.0106.5104.9103.3101.699.897.895.893.691.388.8109 109.0107.5105.9104.3102.5100.798.896.794.592.289.7110 110.0108.5106.9105.2103.5101.799.797.795.593.190.6(%RH と飽和温度の追加の列は、元の表に従って続きます。) --- 重要な用語の説明:「非加圧飽和蒸気」:外部からの圧力が加わらない高湿度環境。 「定常状態」: テスト全体を通じて一定の条件が維持されます。
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